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Heat Sink for Pin Mounting Device, P Series, Aluminum Extrusion Type (17PB23L25)
For TO type mold package devices, for solder fixing
Basic Information
| Application | For pin mounted devices | Heat sink type | Aluminum Extrusion | L(mm) | 25 |
|---|
Please check the type/dimensions/specifications of the part 17PB23L25 in the Heat Sink for Pin Mounting Device, P Series, Aluminum Extrusion Type series.
Specification/Dimensions
-
Surface treatment
- Black Anodize Treatment
- Without Treatment
-
Pin for circuit board mounting
- Available
- NA
-
Tap
- Available
- NA
-
H(mm)
-
W(mm)
Days to Ship
-
- All
- 3 Day(s) or Less
- 4 Day(s) or Less
Specify Alterations
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
Products like this...
| Part Number |
|---|
| 11PB15L25 |
| 11PB15L25-YB |
| 16P16L25 |
| 16P16L25-YB |
| 17PB23L25-YB |
| 20PB20L25-YB |
| Part Number | Standard Unit Price | Minimum order quantity | Volume Discount | Days to Ship | RoHS | Surface treatment | Pin for circuit board mounting | Tap | H (mm) | W (mm) | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
MYR 20.54 | 5 Piece(s) | 4 Day(s) or more | 10 | Without Treatment | Available | NA | 11 | 15 | - | ||
MYR 20.71 | 5 Piece(s) | 4 Day(s) or more | 10 | Black Anodize Treatment | Available | NA | 11 | 15 | Surface treatment: cut surface only, non-anodized | ||
MYR 18.57 | 1 Piece(s) | 3 Day(s) or more | 10 | Without Treatment | NA | NA | 16 | 16.5 | - | ||
MYR 25.65 | 5 Piece(s) | 4 Day(s) or more | - | Black Anodize Treatment | NA | NA | 16 | 16.5 | Surface treatment: cut surface only, non-anodized | ||
MYR 22.36 | 2 Piece(s) | 4 Day(s) or more | 10 | Black Anodize Treatment | Available | Available | 17 | 23.5 | Surface treatment: cut surface only, non-anodized | ||
MYR 22.89 | 2 Piece(s) | 4 Day(s) or more | 10 | Black Anodize Treatment | Available | NA | 20 | 20 | Surface treatment: cut surface only, non-anodized |
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