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Heat Sink for Pin Mounting Device, P Series, Aluminum Extrusion Type (17P23L25)
For TO type mold package devices, for solder fixing
Basic Information
| Application | For pin mounted devices | Heat sink type | Aluminum Extrusion | L(mm) | 25 |
|---|
Specification/Dimensions
-
Surface treatment
- Black Anodize Treatment
- Without Treatment
-
Pin for circuit board mounting
- Available
- NA
-
Tap
- Available
- NA
-
H(mm)
-
W(mm)
Days to Ship
-
- All
- 3 Day(s) or Less
- 4 Day(s) or Less
Specify Alterations
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
Additional Products in this Category
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- Heat Sink for Pin Mounting Device, U Series, Plate Type
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- Accessory For Heating Enclosure - Thermostat
- Heatsink LSI F Multipurpose, General-Purpose Aluminum Extrusion Type (With Clear Anodizing)
- General-Purpose Heat Dissipation Diffuser Plate / Heat Shield For Space Heaters
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